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Zixiao Wang(王子啸), Ph.D.
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I received my Ph.D. in Computer Science and Engineering from The Chinese University of Hong Kong in 2026, under the supervision of Prof. Bei Yu and Prof. Farzan Farnia. Previously, I received my M.Sc. in Computer Science and Technology and my B.Eng. in Automation with a second major in Economics from Tsinghua University.
I will join the Microelectronics Thrust, Function Hub, The Hong Kong University of Science and Technology (Guangzhou) in January 2027. I am recruiting highly self-motivated students for the Spring/Fall 2027 intake. Prospective students with interests in Design for Manufacturability, multi-physics simulation, and related EDA/AI topics are encouraged to send their CV to me by email.
Email: zixiaowang97@gmail.com
Design for Manufacturability
Simulation within EDA
Hardware-efficient Machine Learning
Ph.D. Computer Science and Engineering, The Chinese University of Hong Kong, Aug 2022 - June 2026
M.Sc. Computer Science and Technology, Tsinghua University, Sept 2019 - June 2022
B.Eng. Automation, Tsinghua University, Sept 2015 - June 2019
B.A. Economics (Second Major), Tsinghua University, Sept 2016 - June 2019
| Full Postgraduate Studentship | CUHK | 2022-2026 |
| Outstanding Graduate of Computer Science and Technology | Tsinghua University | 2022 |
| Qi Hang Scholarship | Tsinghua University | 2019 |
| Academician Ni Weidou Scholarship Endowment Fund | Tsinghua University | 2018 |
| Zheng Geru Scholarship | Tsinghua University | 2017 |
| 1st runner-up in MLCAD Contest | MLCAD | 2026 |
| 2nd Place Award in Technical Challenge (Team Vulcan) | RoboCup | 2018 |
| 3rd Place Award in 1v1 Contest (Team Vulcan) | RoboCup | 2018 |
* denotes equal contribution.
[C17] Zixiao Wang, Leilei Jin, Zhen Zhuang, Rongmei Chen, Bei Yu, “CSCO: A Backside-PDN-Aware Clock–Signal Co-Optimization Framework for Improved PPA”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.
[C16] Chaofan Wang, Ziyang Yu, Su Zheng, Zixiao Wang, Yifan Shi, Bei Yu, “Moreau-ILT: Efficient Inverse Lithography Exploiting Weak Convexity”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 08–12, 2026.
[C15] Leilei Jin, Haoyang Xu, Siyuan Liang, Zhen Zhuang, Zhou Hu, Zixiao Wang, Bei Yu, Rongmei Chen, Tsung-Yi Ho, “BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.
[C14] Zixiao Wang, Jieya Zhou, Xinyun Zhang, Shoubo Hu, Farzan Farnia, Bei Yu, “DiffResist: Physics-Constrained Diffusion for Photoresist Modeling”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (poster) (slides)
[C13] Zixiao Wang, Tianshu Hou, Chenghan Wang, Zhen Zhuang, Tsung-Yi Ho, Farzan Farnia, Bei Yu, “FastRW: An Efficient Random Walk Method for Steady-State Thermal Analysis”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper) (poster) (slides) (code)
[C12] Wenbo Xu, Silin Chen, Yibo Huang, Xinyun Zhang, Zixiao Wang, Bei Yu, Ningmu Zou, “Node2Node: Node Adaptation with Transformer for Cross-Node Hotspot Detection”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Italy, Apr. 20–22, 2026. (paper)
[C11] Rongliang Fu, Libo Shen, Ziyi Wang, Zhengxing Lei, Zixiao Wang, Junying Huang, Bei Yu, Tsung-Yi Ho, “DCLOG: Don't Cares-based Logic Optimization using Pre-training Graph Neural Networks”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026. (paper)
[C10] Xinyun Zhang*, Zixiao Wang*, Yurui Kuang, Bei Yu, “Video-based Visible-Event Cross-modal Person Re-identification for Edge AI Surveillance Systems”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), Hong Kong, Jan. 19–22, 2026. (paper) (slides)
[C9] Zixiao Wang, Farzan Farnia, Zhenghao Lin, Yunheng Shen, Bei Yu, “On the Distributed Evaluation of Generative Models”, IEEE/CVF International Conference on Computer Vision Workshops (ICCVW), Honolulu, Oct. 19–20, 2025, pp. 7703–7712. (paper) (arXiv)
[C8] Ziyang Yu, Peng Xu, Zixiao Wang, Binwu Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Bei Yu, Martin Wong, “SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 22–25, 2025. (paper) (poster) (slides)
[C7] Zixiao Wang, Junwu Weng, Mengyuan Liu, Bei Yu, “FlexPose: Pose Distribution Adaptation with Limited Guidance”, AAAI Conference on Artificial Intelligence (AAAI), Philadelphia, Feb. 25–Mar. 04, 2025. (paper) (poster)
[C6] Zixiao Wang, Jieya Zhou, Su Zheng, Shuo Yin, Kaichao Liang, Shoubo Hu, Xiao Chen, Bei Yu, “TorchResist: Open-source differentiable resist simulator”, SPIE Advanced Lithography + Patterning, San Jose, Feb. 23–27, 2025. (paper) (poster) (code)
[C5] Zixiao Wang*, Yunheng Shen*, Xufeng Yao, Wenqian Zhao, Yang Bai, Farzan Farnia, Bei Yu, “ChatPattern: Layout Pattern Customization via Natural Language”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 23–27, 2024. (paper) (poster) (slides)
[C4] Yang Bai, Wenqian Zhao, Shuo Yin, Zixiao Wang, Bei Yu, “ATFormer: A Learned Performance Model with Transfer Learning Across Devices for Large-Scale Transformers”, Empirical Methods in Natural Language Processing (EMNLP), Singapore, Dec. 06–10, 2023. (paper) (poster) (slides)
[C3] Zixiao Wang*, Yunheng Shen*, Wenqian Zhao, Yang Bai, Guojin Chen, Farzan Farnia, Bei Yu, “DiffPattern: Layout Pattern Generation via Discrete Diffusion”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jul. 09–13, 2023. (paper) (poster) (slides)
[C2] Zixiao Wang, Junwu Weng, Chun Yuan, Jue Wang, “Truncate-Split-Contrast: A Framework for Learning from Mislabeled Videos”, AAAI Conference on Artificial Intelligence (AAAI, Oral), Washington, Feb. 7–14, 2023. (paper) (poster) (slides) (code)
[C1] Haijin Ding, Zixiao Wang, Rebing Wu, “Enhancing the security of multi-agent networked control systems using QKD based homomorphic encryption”, IEEE Conference on Decision and Control (CDC), Miami Beach, Dec. 17-19, 2018. (paper)
[J5] Zixiao Wang, Wenqian Zhao, Yunheng Shen, Yang Bai, Guojin Chen, Farzan Farnia, Bei Yu, “DiffPattern-Flex: Efficient Layout Pattern Generation via Discrete Diffusion”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 12, pp. 4679–4690, 2025. (paper)
[J4] Wenqian Zhao, Lancheng Zou, Zixiao Wang, Xufeng Yao, Bei Yu “HAPE: Hardware-Aware LLM Pruning For Efficient On-Device Inference Optimization”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 30, no. 04, pp. 61:1–61:18, 2025. (paper) (Editor's Pick)
[J3] Wenqian Zhao, Shuo Yin, Chen Bai, Zixiao Wang, Bei Yu, “BAQE: Backend-Adaptive DNN Deployment via Synchronous Bayesian Quantization and Hardware Configuration Exploration”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 04, pp. 1394–1405, 2025. (paper)
[J2] Guojin Chen, Zixiao Wang, Bei Yu, David Z. Pan, Martin D.F. Wong, “Ultrafast Source Mask Optimization via Conditional Discrete Diffusion”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 43, no. 07, pp. 2140–2150, 2024. (paper)
[J1] Yang Bai, Xufeng Yao, Qi Sun, Wenqian Zhao, Shixin Chen, Zixiao Wang, Bei Yu, “GTCO: Graph and Tensor Co-Design for Transformer-based Image Recognition on Tensor Cores”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 43, no. 02, pp. 586–599, 2024. (paper)
FastRW: GPU random-walk thermal solver and experiment harness for the FastRW / FasterRW algorithms (Apple Metal + C++17).
TorchResist: An open-source differentiable photoresist simulator that is implemented with Pytorch.
MoreauPruner: Robust pruning framework for large language models against weight perturbations. (paper)
Research Intern, Primarius Technologies, Shanghai, China, 2026.01-2026.06
Research Intern, Huawei Noah's Ark Lab, HongKong, China, 2024.08-2025.05
Research Intern, SenseTime, HongKong, China, 2023.04-2023.12
Research Intern, Tencent AI Lab, Shenzhen, China, 2020.10-2022.08
Research Intern, UBTECH Robotics, Beijing, China, 2017.09-2018.08
Technical Program Committee Member, IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), 2027.
Journal Reviewer, Transactions on Machine Learning Research (TMLR) and IEEE Transactions on Consumer Electronics (TCE).
Conference Reviewer, CVPR, ICCV, ECCV, NeurIPS, ICML, ICLR, and AAAI.
CSCI3320, 2023-R2, Fundamentals of Machine Learning
ENGG2760A, 2023-R1, Probability for Engineers
CSCI5030, 2022-R2, Machine Learning Theory
ENGG2020, 2022-R1, Digital Logic and Systems